Winter is coming and all we can worry about is too much heat. The ghost of Qualcomm may or may not have to do with this Samsung development, though you try disseminating those Snapdragon 810 heat tests and putting that together with Samsung’s decision to go in-house for its chipsets this year.
As best we know it, Samsung is supposed to be manufacturing half of its Galaxy S7 units with its latest Exynos product while the other half, by supply necessity, is going with the Snapdragon 820.
Reports (from what we could tell, likely from Taiwanese parts manufacturers’ stock performance reports) are now suggesting that the company is pursuing an R&D team and manufacturer specializing in heat pipes. It could be looking for some cooling insurance for that Snapdragon, something Qualcomm insists the chipset doesn’t need.
Samsung has not made the decision to include one, but it has been around to different vendors for test batches.
This comes as components makers are working to innovate their products and get per unit prices down to more palatable ranges for buyers like Apple and Samsung.
We’re not sure if the price and chipset situations have come to a confluence here, but we’ll keep our eyes peeled.
Source: UDN (Google Translate)
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